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3D Optical Waveguide Solutions
High Density Co-packaged Optics Solutions
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Advanced Packaging &Testing Services
TGV Interposer Chip
TGV Interposer tape-out OME Service
Advanced Packaging &Testing Services
200G per Lane OE with TGV(（Packaging &Testing)
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Coherent Devices（Packaging &Testing)
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ELSFP assembly and testing
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