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See you at OFC 2026 (Optical Fiber Communications Conference 2026）

2026.01.04 Author：

March 17-19, 2026. Los Angeles, California, United States Los Angeles Convention Center, WEST HALL This product is on display in the WEST HALL, Booth# : 4750
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Meet Our Advanced Package Solutions at WESEMiBAY 2025 (Booth 2E06)

2025.10.13 Author：

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Exciting Showcase at CIOE 2023: 3D Waveguide Chip and Glass-Based CPO Photonic Integration Technology Captivates Audiences, Orders Pouring In!

2025.09.15 Author：

Shenzhen Photonics Valley Technologies made a remarkable appearance at the 26th China International Optoelectronic Exposition (CIOE). Our flagship products, the 3D waveguide chip and glass-based CPO (Co-Packaged Optics) technology, attracted significant a
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Shenzhen Photonics Valley Technologies' glass-based 3D optical waveguide chip production line officially completed and put into production

2025.08.25 Author：

Enabling the next generation of high-density optical interconnects and ushering in a new stage of large-scale mass production
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Meet Shenzhen Photonics Vally at Meet Our Advanced Photonics Solutions at CIOE 2025 (Booth 11C28)

2025.08.29 Author：

CIOE 2025 (Booth 11C28)
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Outstanding Award in China Innovation and Entrepreneurship Competition

2023.02.10 Author：

Space Division Multiplexing Optical Communication Technology,Shenzhen Photonics Valley Technology Co., Ltd., successfully qualified for the national championship and win Outstanding Award in the 14th China Innovation and Entrepreneurship Contest in 2022
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