Join Shenzhen Photonics Valley Technology at COMNEXT 2026 in Tokyo, December 2–4, Booth C2-54. Explore glass-based 3D optical waveguides and NPO/CPO optical interconnect solutions.

Photonics Valley showcased its glass-based 3D optical waveguide technologies at CIOE 2026, debuting its Pluggable CPO Connector and Wafer-Level 3D Optical Waveguide designed for high-density optical interconnects and next-generation AI computing infrastru

September 9-11, 2026, at the Shenzhen World Exhibition & Convention Center,China This product is on display in the HALL 11, Booth# : 11A12

Exhibition time: March 17-19,2026; Venue: Los Angeles Convention Center; Booth number: WEST HALL, #4750

Shenzhen Photonics Valley (SPV) and HYC have strategically partnered to launch a 3D optical waveguide-based Multi-Core MT-FIFO solution. This technology enables high-density, low-loss coupling between silicon photonic chips and multi-core fibers, deliveri

In response to this cutting-edge market demand, LayChip and DoGain have joined forces to launch a high-profile ELSFP optical module solution based on 1310nm CW DFB chips. Centered on DoGain’s in-house developed 100mW high-power DFB laser chips, the soluti