Shenzhen Photonics Valley Technologies made a remarkable appearance at the 26th China International Optoelectronic Exposition (CIOE). Our flagship products, the 3D waveguide chip and glass-based CPO (Co-Packaged Optics) technology, attracted significant attention, leading to a flurry of on-site orders from both domestic and international leading enterprises.
We are proud to announce the successful mass production of China's first production line for "Glass-Based 3D Waveguide Interconnected Chips." With a processing speed of 10-20 seconds per chip, our annual output can reach 300,000 to 400,000 four-core and dual four-core waveguide chips. Our products boast a waveguide transmission loss of less than 0.1 dB/cm, demonstrating high performance, low loss, and strong mass production capabilities. This positions us well to meet the surging demand and provide exceptional service for upcoming orders.
We invite interested clients who recognize the value of our technology to reach out for business discussions. Pricing is open for negotiation.
For business inquiries, please contact:
Jennifer Hu
Email: jennifer@photonicsv.com
The excitement never fades. We look forward to seeing you at OFC 2026 in Los Angeles!
