Shenzhen Photonics Valley Technologies' glass-based 3D optical waveguide chip production line officially completed and put into production

On August 25, 2025, Shenzhen Photonics Valley Technologies announced the successful completion and official launch of its independently constructed glass-based 3D optical waveguide chip production line. This production line marks a major breakthrough in the industrialization of the company's core 3D optical waveguide technology and will provide solid mass production support for multi-core optical interconnects and next-generation data center communications.

The new production line utilizes proprietary femtosecond laser direct writing equipment and is equipped with a high-precision dual six-axis automated coupling stage, enabling rapid processing and efficient testing of 3D optical waveguide structures. Waveguide chip processing efficiency reaches 10s/chip, with an annual production capacity exceeding 500,000 chips. The chip's end-to-end insertion loss is kept below 0.5dB, meeting the industry's stringent requirements for low loss and high integration, laying a solid foundation for large-scale applications.

The first batch of mass-produced products on this production line focuses on 4-core optical waveguide chip and dual-4-core waveguide chips, which can be widely used in multi-core fiber fan-in and fan-out devices and multi-core optical modules. Compared with traditional parallel transmission solutions, the 3D optical waveguide solution can significantly reduce the complexity and cost of optical fiber wiring, meeting the needs of data centers evolving towards ultra-high capacity of 800G/1.6T/3.2T. Furthermore, its scalable process platform also provides process support for the future mass production of 7-core optical waveguide chip and more channel chips.

Dr. Luping Du, Chairman of Shenzhen Photonics Valley Technologies, stated:

"Glass-based 3D optical waveguide chips are core components for next-generation high-density optical interconnects. The commissioning of this production line not only demonstrates our world-leading mass production capabilities but also gives Chinese solutions a competitive edge in the global optical communications market. Going forward, the company will continue to deepen process optimization and product iteration to serve diverse application scenarios, including data centers, AI computing, 5G/6G communications, and submarine optical cables."

With the official launch of this production line, Shenzhen Photonics Valley Technologies will accelerate its expansion into multi-core optical interconnects and CPO advanced packaging, driving the optical communications industry towards higher bandwidth, lower power consumption, and higher density.

Shenzhen Photonics Valley Technologies sincerely welcomes partners and application companies upstream and downstream of the industry chain to collaborate and jointly promote the development and application of multi-core interconnects and CPO advanced packaging technologies.

Shenzhen Photonics Valley Technologies will exhibit the lastest products at the 26th China International Optoelectronic Exposition.

Date: September 10-12, 2025

Location: Shenzhen World Exhibition & Convention Center (Bao'an New Hall)

Booth: 11C28

Shenzhen Photonics Valley Technology Co., Ltd

TEL:  +86-755-84652252

Email: info@photonicsv.com

Web: www.photonicsv.com.en