Meet Our Advanced Package Solutions at WESEMiBAY 2025 (Booth 2E06)
Exhibition:WESEMiBAY 2025; Booth Number:2E06; Time: 2025.10.15-10.17; ADD: Shenzhen Convention and Exhibition Center (Futian)
2025.08.29read:1011
Visit us at CIOE 2025 (Sept 10-12, Shenzhen World Exhibition & Convention Center) – Booth 11C28.
Key Exhibits:
✔ Optical Waveguide Chips
✔ TGV (Through-Glass Via) Chips
✔ TGV Interposer Solutions
✔ CPO (Co-Packaged Optics) Advanced Packaging
Join us to explore cutting-edge innovations and discuss collaboration opportunities. Looking forward to meeting you!


Exhibition:WESEMiBAY 2025; Booth Number:2E06; Time: 2025.10.15-10.17; ADD: Shenzhen Convention and Exhibition Center (Futian)

The 7th China Harbin International Scientific and technological achievements exhibition fair and the third 45 ° north latitude innovation forum was held in Harbin.