See you at CIOE 2026 The 27th China International Optoelectronic Exposition
September 9-11, 2026, at the Shenzhen World Exhibition & Convention Center,China This product is on display in the HALL 11, Booth# : 11A12
On September 11, the 26th China International Optoelectronic Exposition (CIOE 2026) concluded successfully in Shenzhen. Photonics Valley featured its glass-based 3D optical waveguide chips and optical interconnect core components at Booth 11A12 (Hall 11), showcasing its latest advancements in high-speed optical interconnects and NPO/CPO advanced packaging.
High-Energy Engagement & Meaningful Connections
Throughout the event, Photonics Valley attracted a steady stream of industry professionals, clients, and investors. Our technical team delivered live demonstrations and in-depth presentations on 3D optical waveguides, engaging in fruitful discussions around high-density optical interconnects, complex optical routing, and customized development.
Innovative Solutions: New Products Take the Stage
Photonics Valley presented its core product line—including multi-core fiber FIFO waveguide chips, PIC fan-in/fan-out chips, and 3D waveguide multi-core MT assemblies. Two ground-breaking products made their public debut:
Pluggable CPO Connector: Combines 3D optical waveguides with pluggable interfaces, providing a flexible solution for high-density CPO optical connections.
Wafer-Level 3D Optical Waveguide: Extends 3D waveguide technology into wafer-level manufacturing and integration, opening new pathways for high-density photonic integration and advanced packaging.
Moving Forward: Driving the Future of Optical Interconnects
CIOE 2026 served as a vital platform to demonstrate our technological achievements and deepen industry collaboration. Photonics Valley remains committed to pushing the boundaries of glass-based 3D optical waveguides and high-density optical interconnect technologies to power next-generation AI computing infrastructure.
A successful exhibition marks both a validation of past achievements and the start of next-stage innovation. We sincerely thank all our partners, clients, and visitors for their trust and support. Photonics Valley will continue to advance optoelectronic integration to empower global AI computing infrastructure.
Upcoming Events · Join Us Next
1. COMNEXT Tokyo 2026
Dates: December 2 – December 4, 2026
Venue: Tokyo Big Sight, Japan
Focus: Optical Communications, Optoelectronic Fusion, Wireless & 5G/6G
2. OFC 2027
Dates: March 9 – March 11, 2027
Venue: Los Angeles Convention Center, CA, USA
Focus: AI Data Centers, Optical Networks, CPO/NPO & High-Speed Interconnects
The conclusion of an exhibition serves as both a validation of our milestone R&D achievements and a launchpad for the next phase of innovation. Photonics Valley firmly believes that breakthroughs in high-speed optical interconnects rely on the synergy of the entire supply chain. We sincerely thank every client and partner for their ongoing trust and support. Moving forward, Photonics Valley will continue to deepen its R&D layout in advanced packaging and optoelectronic integration, empowering the global AI computing infrastructure with groundbreaking technologies and products.
Contact Us
Tel: +86-755-84652252
Mobile: +86-189 4877 6698
Email: info@photonicsv.com
Address: Room 1202, Bldg 1, Phase I, Dongjiu Innovation Technology Park, No.76 Bulan Rd, Longgang District, Shenzhen, Guangdong, China
Website:
https://www.photonicsv.com