Designed specifically for 800G/1.6T multi-core optical modules in data centers and CPO optical engines, this product features an ultra-low fiber-to-fiber loss of typically 0.4–0.5 dB, enabling next-generation high-density optical interconnect applications.
By fabricating two 4-core waveguide chips adjacent to each other, the product achieves a standard 8-channel array layout with 250 µm pitch, perfectly matching the transmit/receive interface requirements of mainstream 8-channel silicon photonic optical modules, making it a key supporting component for the upgrade of optical interconnect architectures.
Dual 4-core Waveguide Chip
Product Description
- Specification
- Precise Structural Matching1×8 channel arrangement with 250 µm standard pitch array realized via dual-chip integration, enabling seamless connection with high-speed silicon photonic modules or CPO optical engines.
- Designed for 800G/1.6TFully compliant with mainstream 8×100G and 8×200G module architectures, suitable for various module standards including DR4/DR8.
- Excellent Insertion Loss PerformanceBased on self-developed femtosecond laser direct writing technology, the waveguide channel loss is below 0.6 dB (typical 0.4–0.5 dB), effectively ensuring long-haul, high-bandwidth transmission quality.
- Compact Structure & Packaging FriendlyDual-chip common-substrate design facilitates integrated packaging with TOSA/ROSA components. The millimeter-scale form factor enables perfect integration inside optical modules.
