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Datacenter interconnection

With the continuous growth of data traffic, data centers are facing increasingly severe challenges in terms of bandwidth, performance, and cost. Two core technologies provided by Shenguang Valley Technology - TGV advanced packaging and 3D waveguide - have shown great application potential in the field of data centers.


The TGV advanced packaging technology can provide high-bandwidth, high-performance, and low-cost optical engine solutions for the optical modules in data centers. By using glass-based interposer chips, the TGV technology has broken through the bottleneck of traditional optoelectronic interconnection. It not only significantly improves the bandwidth density of the optical communication system but also optimizes the efficiency of optoelectronic coupling, thus achieving low-loss and high-speed signal transmission. This enables data centers to handle larger-scale data traffic, support computing-intensive tasks such as cloud computing, big data analysis, and machine learning. At the same time, it reduces the manufacturing cost of optical modules, providing strong support for the efficient operation of data centers.


The 3D waveguide technology provides an innovative optical fiber cabling solution for data centers. By combining multi-core FIFO devices with multi-core optical fiber cabling, the 3D waveguide technology effectively simplifies the optical fiber cabling inside data centers, reduces the number of optical fiber connections and space occupation, and greatly improves the density and efficiency of cabling. This technology can also be integrated into optical modules as a multi-core optical module solution to further optimize the performance and stability of data transmission. In data centers, the 3D waveguide can not only effectively reduce the complexity of system cabling but also provide efficient multi-channel optical interconnection, helping data centers improve the information processing speed and reliability.


Through the TGV advanced packaging and 3D waveguide technologies, Shenguang Valley Technology has provided optical engine solutions with higher bandwidth, higher performance, and lower cost for data center construction, promoting the development of data centers towards a more efficient, green, and intelligent direction.


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The 800G Tx TGV optoelectronic interposer chip realizes glass-based signal conversion through laser-induced and deep silicon etching. By utilizing the redistribution layer (RDL) and micro-bumping processes, it achieves a wiring bandwidth of over 110GHz, significantly improving the signal transmission efficiency and density. It matches the mainstream eight-channel silicon photonic modulation chips and electrical driver chips to achieve an 8-channel standardized solution. Meanwhile, it is compatible with the pin definitions of mainstream silicon photonic chips and electrical chips, realizing a high degree of integration in optoelectronic hybrid packaging. On the chip, it can integrate the laser direct writing optical waveguide and the internal slotting of the interposer, realizing low-loss and high-density optical path fan-in and fan-out.

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OEM Wafer Fabrication Service for TGV Interposer Solution

Based on the mature and reliable 8-inch wafer-level manufacturing process, through laser-induced, deep silicon etching, redistribution layer (RDL) and micro-bumping processes, a TGV interposer wafer that supports a wiring bandwidth of over 110GHz can be realized. It provides standardized solutions with 4/8/16 channels, and is compatible with the pin definitions of mainstream optical chips (such as EML, VCSEL, silicon photonics, lithium niobate) and electrical chips (such as DML, DRV, TIA, DSP). By adopting the laser direct writing optical waveguide process and 2.5D/3D stacking and packaging technologies, a high degree of integration in optoelectronic hybrid packaging is achieved. While supporting customized processing of wafer-level TGV interposers, it can also customize multi-scheme wafers through MPW (Multi-Project Wafer), significantly reducing the production costs for large-scale production. It has the advantages of low crosstalk, high-speed signal integrity and ultra-high integration, and can effectively solve the bottleneck problems of ultra-high-speed optical engine packaging, becoming a key technology for high-speed optical interconnection in the next-generation data center.

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7-core Optical Waveguide Chip

1、Based on the advanced 3D laser direct writing technology. 2、It has high optical transmittance ranging from the visible light spectrum (VIS) to the near-infrared spectrum (NIR). 3、It has a mode field diameter similar to that of an optical fiber. 4、With low dielectric loss, it is suitable for applications above 20GHz. 5、It is compatible with the TGV (Through-Glass-Via) via technology and the silicon photonics process platform. 6、It features high dimensional stability, thermal stability, and chemical stability. 7、It has low transmission loss and coupling loss. 8、It has a circular cross-section, with the size being controllable, and is compatible with high-order modes.

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Customized Optical Waveguide Chip

It supports customization of the number of channels, pitch, and position.

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Silicon Photonics PIC to Fiber Array Chip

The three-dimensional photonic interconnection chip of Deep Optics Valley Technology adopts femtosecond laser direct writing technology to precisely form a three-dimensional optical waveguide structure within the glass substrate. This chip is widely used in scenarios such as the interconnection between silicon photonics chips and fiber arrays, the fan-in and fan-out of multi-core optical fibers, and high-density optical routing and switching. Its advantages include an ultrafast waveguide writing speed, an ultra-low waveguide transmission loss, a flexible routing design, and excellent reliability, meeting the requirements of high-performance photonic interconnections.

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