Silicon Photonics PIC to Fiber Array Chip

The three-dimensional photonic interconnection chip of Deep Optics Valley Technology adopts femtosecond laser direct writing technology to precisely form a three-dimensional optical waveguide structure within the glass substrate. This chip is widely used in scenarios such as the interconnection between silicon photonics chips and fiber arrays, the fan-in and fan-out of multi-core optical fibers, and high-density optical routing and switching. Its advantages include an ultrafast waveguide writing speed, an ultra-low waveguide transmission loss, a flexible routing design, and excellent reliability, meeting the requirements of high-performance photonic interconnections.