OEM Wafer Fabrication Service for TGV Interposer Solution

Based on the mature and reliable 8-inch wafer-level manufacturing process, through laser-induced, deep silicon etching, redistribution layer (RDL) and micro-bumping processes, a TGV interposer wafer that supports a wiring bandwidth of over 110GHz can be realized. It provides standardized solutions with 4/8/16 channels, and is compatible with the pin definitions of mainstream optical chips (such as EML, VCSEL, silicon photonics, lithium niobate) and electrical chips (such as DML, DRV, TIA, DSP). By adopting the laser direct writing optical waveguide process and 2.5D/3D stacking and packaging technologies, a high degree of integration in optoelectronic hybrid packaging is achieved. While supporting customized processing of wafer-level TGV interposers, it can also customize multi-scheme wafers through MPW (Multi-Project Wafer), significantly reducing the production costs for large-scale production. It has the advantages of low crosstalk, high-speed signal integrity and ultra-high integration, and can effectively solve the bottleneck problems of ultra-high-speed optical engine packaging, becoming a key technology for high-speed optical interconnection in the next-generation data center.