2026.10.20read:3617
Join us in Tokyo, Japan, on December 2–4, 2026!
Shenzhen Photonics Valley Technology will showcase its glass-based 3D optical waveguide products and solutions at COMNEXT 2026 — Optical Communication World (FOE).
We warmly invite customers, partners, and industry professionals to visit us at Booth C2-54 in the West Exhibition Halls. Meet our team to discuss products and technologies, and explore optical interconnect opportunities for AI computing, data centers, and NPO/CPO applications.
Exhibition: COMNEXT 2026 — Optical Communication World (FOE)
Dates: December 2–4, 2026 (Wednesday–Friday)
Venue: TOKYO BIG SIGHT, Tokyo, Japan
Our Booth: C2-54, West Halls 3 & 4, 4F, West Exhibition Building
Registration is free before the November 24, 2026 deadline (Japan Standard Time). After the deadline, a registration fee of JPY 5,500, including tax, applies.
Click the link below to register for your free admission pass:
At the exhibition, Shenzhen Photonics Valley Technology will highlight:
Laser direct-written 3D optical waveguide solutions
Multicore fiber fan-in/fan-out (FIFO) waveguide chips and devices
3D waveguide multicore-to-MT assemblies
High-density fan-in/fan-out chips and assemblies for NPO/CPO
Pluggable connectors for CPO
We will also showcase our wafer-level 3D optical waveguide fabrication and chip volume production capabilities. We look forward to discussing design, integration, and application requirements spanning chips and assemblies with industry partners.
From multicore fiber connectivity and photonic integrated circuit (PIC) interface adaptation to high-density fan-in/fan-out chips and connectors for NPO/CPO, we look forward to sharing our latest product and technology developments and discussing the optical interconnect needs of your projects.
Please contact our sales team in advance with your planned visit time, products of interest, and topics for discussion so we can arrange a meeting with the right team members.
December 2–4 | Tokyo | Booth C2-54
We look forward to welcoming you!
Bridging AI Compute with Light.
Photonics Valley showcased its glass-based 3D optical waveguide technologies at CIOE 2026, debuting its Pluggable CPO Connector and Wafer-Level 3D Optical Waveguide designed for high-density optical interconnects and next-generation AI computing infrastru
