PIC Fan-out Interconnect Optical Waveguide Chip

The PIC fan-out interconnect optical waveguide chip is based on the femtosecond laser direct writing technology independently mastered by Deep Optics Valley. It can match the self-developed PIC and mainstream PICs, and customize the arrangement of optical ports on the end faces of chips and devices such as FA, MT ferrules, and MCF. It enables the processing and preparation of structures in any three-dimensional shape, providing possibilities for meeting the requirements of optical path fan-in and fan-out of optical chips. Through the femtosecond laser direct writing technology, a miniaturized and low-loss three-dimensional optical waveguide chip with low transmission loss, a circular cross-section, and a highly symmetric mode field can be fabricated on a glass substrate. This is of great significance for realizing high-density optical interconnection products.