1、Based on advanced 3D laser direct writing technology;
2、High optical transmittance from VIS to NIR;
3、Mode field diameter similar to optical fiber;
4、Low dielectric loss, suitable for 20GHz+;
5、Compatible with TGV through-hole technology and silicon photonics process platform;
6、High dimensional stability, thermal stability and chemical stability;
7、Low transmission loss and coupling loss;
8、Circular cross-section, controllable size, compatible with high-order modes.
