With the explosive growth of artificial intelligence (AI) large model technologies, data centers across the globe are undergoing an unprecedented transformation in computing power architecture. The exponential rise in demand for AI training and inference has imposed stringent requirements on data transmission bandwidth within data centers and for interconnection networks.
Against this backdrop, co-packaged optics (CPO) has enabled high-efficiency, low-power consumption transmission of high-speed signals. The External Laser Source Form-factor Pluggable (ELSFP) solution, featuring external high-power lasers and blind-mate connectivity, perfectly addresses the pressing need of silicon photonics engines for high-power, multi-channel continuous-wave (CW) light sources, establishing itself as a key enabling technology for CPO.
Product Introduction: High-Performance 1310nm CW DFB ELSFP Module
In response to this cutting-edge market demand, LayChip and DoGain have joined forces to launch a high-profile ELSFP optical module solution based on 1310nm CW DFB chips. Centered on DoGain’s in-house developed 100mW high-power DFB laser chips, the solution leverages LayChip’s top-tier packaging design and manufacturing capabilities to realize a fully compliant ELSFP module meeting OIF standards.
This product features the following outstanding characteristics:
l High Power Output: Single-channel optical power up to 20 dBm (100 mW), with an integrated 8-channel continuous-wave (CW) laser array.
l Wide Wavelength Application Range: Supports 8-channel 1310 nm and 2×FR4.
l Low Power Consumption & High Energy Efficiency: Optimized for low-power scenarios, significantly reducing data center PUE values and enabling green computing.
l Standardization & Compatibility: Fully compliant with OIF ELSFPIA CMIS 5.1 and OIF-ELSFP-02.0 standards, ensuring seamless interoperability with mainstream switches and silicon photonics engines.
l Operating temperature range from 0°C to 70°C, and fully RoHS-6 compliant.
As a core component of the ELSFP module, the 100 mW high-power DFB laser used in this product is fully independently developed by DoGain. It is a mainstream specification in DoGain’s general high-power DFB laser product family, featuring high conversion efficiency, low power attenuation at high temperatures, excellent side-mode suppression ratio, ideal beam divergence, and outstanding long-term reliability. Its wavelength coverage meets multiple requirements for DR and FR applications.
In response to industry needs, DoGain has newly developed 200 mW and 400 mW high-power DFB laser series and launched them to the market, which have received an enthusiastic market response.
Partner: DoGain – A Leader in High-End Laser Chips
The core chips of this solution are supplied by DoGain. As a leading enterprise in the upstream optoelectronics industry chain, Company A has long taken the design and manufacturing of high-end laser chips as its core competitiveness.
The company has built comprehensive engineering capabilities spanning the full life cycle of compound semiconductor laser chips, supported by in-house manufacturing facilities of over 60,000 square meters. It has realized fully independent and controllable mass production covering chip design, epitaxial growth, precision device processing, packaging, rigorous testing, characterization, reliability verification, and final functional module integration.
DoGain focuses on the R&D of high-performance, high-power, and high-reliability optoelectronic chips and devices. Its data communication series of VCSEL, DFB, and PD chips have gained increasing recognition from manufacturers worldwide for their outstanding performance and long-term stability, laying a solid physical foundation for the successful launch of this ELSFP module.
About Us: LayChip – Empowering High-Speed Optical Transmission and High-Performance Computing
LayChip is committed to “Enabling High-Speed Optical Transmission and High-Performance Computing”. As an innovator and pioneer in optoelectronic packaging design and manufacturing, we officially put our new modern production base into operation in 2025.The base covers an area of 5,000 square meters, including a 2,000-square-meter high-standard cleanroom, equipped with internationally advanced automated production lines and testing equipment.
Relying on our strong engineering transformation capabilities, we not only provide packaging services but also deliver one-stop solutions for customers covering thermal simulation, optical design, and circuit design.This collaboration with LayChip stands as a strong testament to our technological strength.We will continue to deepen our focus on silicon photonics supporting applications, unlock the full potential of top-tier chips with exquisite packaging technology, and build faster, more stable, and more efficient optical interconnect links for global AI data centers, jointly embracing new opportunities in the intelligent computing era.
