Driven by the rapid growth of AI, large-scale model training, and high-performance computing (HPC), data center bandwidth demands are surging. The exponential increase in data exchange between compute nodes necessitates optical interconnects that offer higher speeds, lower latency, and greater density. Consequently, optical module capacities are evolving from 400G and 800G toward the 1.6T era.
Simultaneously, the sheer volume of fibers required within data centers is challenging the cabling density and space efficiency of traditional single-core fibers. Multi-Core Fiber (MCF), which integrates multiple cores into a single strand, has emerged as a pivotal solution for boosting transmission capacity in high-density interconnects. However, MCF adoption imposes stricter requirements on internal optical components, demanding miniaturized designs with higher integration, low-loss coupling performance, and scalability for mass production.
Shenzhen Photonics Valley (SPV) and HYC have strategically partnered to launch a 3D optical waveguide-based Multi-Core MT-FIFO solution. This technology enables high-density, low-loss coupling between silicon photonic chips and multi-core fibers, delivering the critical integration needed for next-gen AI data centers and high-speed optical modules.
Fig. 1. MT+MCF-FIFO assembly based on 3D optical waveguide chips.
Fig. 2. Structural parameters and key metrics of the 3D optical waveguide chip & MT+MCF-FIFO assembly
Innovative Architecture Enabling High-Density Coupling
To address the challenges of high-density connectivity between silicon photonic chips and multi-core MT interfaces, SPV and HYC have jointly launched a FIFO component solution featuring an innovative 3D optical waveguide architecture. This component integrates three glass optical waveguide chips independently developed by SPV:
l Receiver End: Two 4-core waveguide chips with a 750 μm pitch.
l Transmitter End: One dual-4-core (8-core) waveguide chip with a 250 μm pitch.
Leveraging HYC’s precision coupling expertise and mature packaging processes, the solution achieves ultra-high alignment accuracy between the waveguide chips and multi-core fiber arrays, all encapsulated within a standard MT ferrule structure.
Despite its compact design, the solution delivers exceptional optical performance:
l Transmitter (TX): Typical insertion loss < 1.05 dB.
l Receiver (RX): Typical insertion loss < 1.35 dB.
By combining high-density integration with low loss and high stability, this solution meets the stringent performance and reliability requirements of modern high-speed data center interconnects. Furthermore, built on mature glass waveguide fabrication and standardized MT packaging, the design ensures high assembly precision and manufacturing consistency, offering the process stability and scalability needed for massive future data center deployments.
Strategic Alliance: Building a Robust Industry Ecosystem
This collaboration seamlessly integrates the core technological strengths of both industry leaders. As a premier supplier of glass-based photonic interconnect chips, SPV brings deep expertise in the design and manufacturing of high-precision 3D optical waveguides, enabling the custom development of high-performance coupling chips tailored for multi-core fiber (MCF) applications. HYC complements this with extensive experience in passive optical device packaging and precision connectivity. Its mature automated coupling and packaging production lines ensure the scalable manufacturing and high reliability essential for MCF-FIFO components.
Both parties emphasize that this partnership not only achieves a powerful synergy of key technical capabilities but also injects new momentum into the collaborative development of the multi-core fiber supply chain. Looking ahead, SPV and HYC are committed to deepening their cooperation to accelerate the deployment of multi-core optical interconnect technologies in data centers, delivering solutions that are more efficient, compact, and ready for large-scale industry adoption.
Live Demonstration at OFC 2026
The groundbreaking Multi-Core Fiber FIFO solution, powered by advanced 3D optical waveguide technology, will make its official debut at OFC 2026, held from March 17–19 in Los Angeles, California.
Industry professionals are cordially invited to visit our booths for live demonstrations and in-depth discussions on the innovative applications and technical advantages of this solution for high-density optical interconnects:
l SPV Booth: West Hall, #4750
l HYC Booth: South Hall, #1149
Join us to explore the future of scalable, high-performance data center connectivity.
About Shenzhen Photonics Valley Technology Co., Ltd.
Shenzhen Photonics Valley Technology Co., Ltd. (SPV) is a global leader in the manufacturing of 3D optical waveguide chips. Dedicated to the R&D and industrialization of glass-based photonic integration, SPV is strategically positioned at the forefront of high-speed optical interconnects and Co-Packaged Optics (CPO).
The company has established a comprehensive portfolio centered on three core pillars:
l Glass-based 3D Optical Waveguide Chips
l Glass-based TGV (Through-Glass Via) Interposer Chips
l CPO Optical Engines and Packaging Services
Through these offerings, SPV delivers high-density, high-performance photonic integration solutions tailored for the demands of high-speed interconnects and high-performance computing (HPC).
Backed by a world-class R&D team led by top-tier scientists and industry veterans from leading global semiconductor and optical communication firms, SPV possesses end-to-end capabilities ranging from cutting-edge technology research to large-scale manufacturing deployment.
About HYC Co., Ltd.
Founded in 2000, HYC Co., Ltd. (HYC) is a premier provider of integrated R&D, manufacturing, sales, and service solutions for high-performance passive optical devices. The company specializes in customizing solutions for a diverse portfolio of foundational optical components, including:
l Optical Interconnect Products
l High-Speed Transceiver Modules & CPO Optical Components
l Multi-Core Fiber (MCF) Assemblies
l PLC Splitters
l WDM (Wavelength Division Multiplexing) Devices
HYC’s products are widely deployed across critical sectors driving the digital economy, including Artificial Intelligence (AI), large-scale data centers, cloud computing, and next-generation 5G/6G high-speed communications.
