TGVI High-speed T/ROSA OE

The TGVI high-speed T/ROSA OE product is based on the self-developed TGV optoelectronic interposer chip by Deep Optics Valley. Through laser-induced and deep silicon etching technologies, as well as the redistribution layer (RDL) and micro-bumping processes, it realizes the packaging interconnection of optoelectronic chips and the conversion of optoelectronic signals based on the glass substrate. The self-developed TGV interposer chip can achieve a wiring bandwidth of over 110GHz, significantly improving the signal transmission efficiency and density. It matches the mainstream silicon photonic modulation chips and electrical driver chips in the market, realizing the integration of 4/8-channel standardized solutions. At the same time, it is compatible with the pin definitions of mainstream silicon photonic chips and electrical chips, achieving a high degree of integration in optoelectronic hybrid packaging. On the chip, it can integrate the laser direct writing waveguide and the internal slotting structure of the interposer, and can support low-loss coupling with FAU, MT ferrules, MCF, etc., realizing high-density optical path fan-in and fan-out.