400G TRx TGV Optoelectronic Interposer Chip

The TRx TGV optoelectronic interposer chip realizes signal conversion based on the glass substrate through laser-induced and deep silicon etching. By utilizing the redistribution layer (RDL) and micro-bumping processes, it achieves a wiring bandwidth of over 110GHz, significantly improving the signal transmission efficiency and density. It matches the mainstream four-channel silicon photonic modulation chips, electrical driver chips, and transimpedance amplifier chips to achieve a 4-channel standardized solution. At the same time, it is compatible with the pin definitions of mainstream silicon photonic chips and electrical chips, realizing a high degree of integration in optoelectronic hybrid packaging. On-chip, it can integrate the laser direct writing optical waveguide and the internal slotting of the interposer, achieving low-loss and high-density optical path fan-in and fan-out.