With the deployment of 5G and the upcoming 6G networks, the global demand for high-speed, large-bandwidth, and low-latency optical communication has risen sharply. The TGV advanced packaging and 3D waveguide technologies of Shenguang Valley Technology provide breakthrough solutions for 5G/6G communication.

The TGV advanced packaging technology can effectively break through the bandwidth bottleneck of the traditional Through Silicon Via (TSV) technology and provide optoelectronic interconnection solutions with higher bandwidth and lower loss. Through high-precision glass-based interposer chips and precise optoelectronic coupling, the TGV technology can not only increase the transmission speed of optical signals but also support larger-scale optical interconnection systems. This is particularly crucial in 5G/6G networks because with the upgrade of the network architecture and the expansion of spectrum resources, the bandwidth requirements of communication systems have increased sharply. The TGV technology can meet these requirements, support high-speed data transmission in coherent optical communication systems, and promote the efficient development of the next-generation optical fiber networks.

The 3D waveguide technology provides another efficient solution in 5G/6G networks. Through the use of multi-core optical fibers and the integration of high-density optical modules, the 3D waveguide technology can effectively support large-scale network deployment, simplify optical fiber cabling, and improve the optical transmission efficiency of the network. In addition, the 3D waveguide can also achieve higher-density optical interconnection in optical modules, support high-speed data transmission in 5G and 6G networks, and ensure the efficient operation of communication networks.

The TGV and 3D waveguide technologies of Shenguang Valley Technology provide efficient and low-cost optoelectronic interconnection solutions for 5G/6G networks, promoting the development of global communication networks towards higher performance and lower cost.